Last week, Samsung held its annual Foundry Forum in the U.S. At the event, the company revealed a roadmap that takes its process technology to 7nm Low Power Plus, 5nm Low Power Early and 3nm Gate-All-Around Early/Plus. The 7nm LPP process will be Samsung's first to use an EUV lithography solution, and should be ready for production during the second half of this year. Mass production of parts using the new process will start in the first half of 2019. That happens to be when rival TSMC will start mass production of parts using its 7nm+ node (also using EUV lithography), and start risk production ...
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